LICENSE.txt

© 2014 Microsoft Corporation, Dell Inc., Facebook Inc., Broadcom Corporation,
Intel Corporation, Mellanox Technologies Ltd.


As of January 1, 2017, the following persons or entities have made this
Specification available under the Open Web Foundation Final Specification
Agreement (OWFa 1.0), which is available at
http://www.openwebfoundation.org/legal/the-owf-1-0-agreements/owfa-1-0
Microsoft Corporation, Dell Inc., Mellanox Technologies Ltd., Cavium,
Centec Networks, Marvell International Ltd., Barefoot Networks, Facebook Inc.,
Intel Corporation.


You can review the signed copies of the Open Web Foundation Agreement Version
1.0 for this Specification at http://opencompute.org/licensing/, which may also
include additional parties to those listed above.

Your use of this Specification may be subject to other third party rights. THIS
SPECIFICATION IS PROVIDED "AS IS." The contributors expressly disclaim any
warranties (express, implied, or otherwise), including implied warranties of
merchantability, noninfringement, fitness for a particular purpose, or title,
related to the Specification. The entire risk as to implementing or otherwise
using the Specification is assumed by the Specification implementer and user.
IN NO EVENT WILL ANY PARTY BE LIABLE TO ANY OTHER PARTY FOR LOST PROFITS OR ANY
FORM OF INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES OF ANY
CHARACTER FROM ANY CAUSES OF ACTION OF ANY KIND WITH RESPECT TO THIS
SPECIFICATION OR ITS GOVERNING AGREEMENT, WHETHER BASED ON BREACH OF CONTRACT,
TORT (INCLUDING NEGLIGEN CE), OR OTHERWISE, AND WHETHER OR NOT THE OTHER PARTY
HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.

THE FOLLOWING IS A LIST OF MERELY REFERENCED TECHNOLOGY: Microprocessor
technology, semiconductor manufacturing technology, operating system technology
(including without limitation networking operating system technology),
emulation technology, graphics technology, video technology, integrated circuit
packaging technology and the like, compiler technologies, object oriented
technology, optical/RF communications technology including chip I/O and driver
technology, bus technology, memory chip technology (including, without
limitation, NAND memory, NOR memory, resistive RAM (RRAM), seek scan probe
(SSP) memory, nonvolatile memory (including without limitation, memory based on
chalcogenide materials, phase change memory (PCM), one or more stacked
layers of memory cells, embedded PCM memories, non-volatile cache memory,
solid state drives, SRAM, embedded DRAM, ferro-electric memory, and polymer
memory)) and/or health-related and medical technology. IMPLEMENTATION OF
THESE TECHNOLOGIES MAY BE SUBJECT TO THEIR OWN LEGAL TERMS.